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惠通科技(301601)
融资融券更新时间：2025-10-30
指标2025-10-302025-10-292025-10-282025-10-272025-10-242025-10-232025-10-222025-10-212025-10-202025-10-172025-10-162025-10-152025-10-142025-10-132025-10-102025-10-092025-09-302025-09-292025-09-262025-09-25
融资余额(万元)5689.325693.55606.235520.585522.895674.295974.556287.496325.466453.216341.816340.076474.126508.626500.896334.096388.616355.846368.456309.21
融资买入额(万元)379.11403.69251.24513.68165.69207.7125.47188.6777.02280.22172.87211.68289.05270.07309.79252.24259.02201.11211.87200.94
融资偿还额(万元)383.3316.42165.59515.99317.09507.96438.41226.64204.77168.82171.13345.73323.55262.34142.99306.76226.24213.72152.64254.4
融券余量(万股)00000000000000000000
融券卖出量(万股)00000000000000000000
融券偿还量(万股)00000000000000000000
融券余额(万元)00000000000000000000
融资融券余额(万元)5689.325693.55606.235520.585522.895674.295974.556287.496325.466453.216341.816340.076474.126508.626500.896334.096388.616355.846368.456309.21
融资融券差额(万元)5689.325693.55606.235520.585522.895674.295974.556287.496325.466453.216341.816340.076474.126508.626500.896334.096388.616355.846368.456309.21
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