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天沃科技(002564)
融资融券更新时间:2023-06-29
指标2023-06-292023-06-282023-06-272023-06-262023-06-212023-06-202023-06-192023-06-162023-06-152023-06-142023-06-132023-06-122023-06-092023-06-082023-06-072023-06-062023-06-052023-06-022023-06-012023-05-31
融资余额(万元)6889.476913.616969.646979.586996.737056.167076.017080.987335.277343.117367.347383.557394.447397.827408.477411.687414.467422.937427.987446.02
融资买入额(万元)00000000000000000000
融资偿还额(万元)24.1456.039.9517.1559.4319.844.98254.297.8324.2416.2110.893.3810.653.22.798.475.0518.0433.02
融券余量(万股)00000000000000000000
融券卖出量(万股)00000000000000000000
融券偿还量(万股)00000000000000000000
融券余额(万元)00000000000000000000
融资融券余额(万元)6889.476913.616969.646979.586996.737056.167076.017080.987335.277343.117367.347383.557394.447397.827408.477411.687414.467422.937427.987446.02
融资融券差额(万元)6889.476913.616969.646979.586996.737056.167076.017080.987335.277343.117367.347383.557394.447397.827408.477411.687414.467422.937427.987446.02
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