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鼎通科技(688668)
融资融券更新时间：2025-10-28
指标2025-10-282025-10-272025-10-242025-10-232025-10-222025-10-212025-10-202025-10-172025-10-162025-10-152025-10-142025-10-132025-10-102025-10-092025-09-302025-09-292025-09-262025-09-252025-09-242025-09-23
融资余额(万元)76329.7777266.9167411.5765258.9566386.2158819.6851399.3751119.0552403.8350255.5249722.1750716.0154309.5457450.8357935.7860329.8660379.4360949.7563190.763557.74
融资买入额(万元)9447.5326889.8416731.4111703.6120724.5515796.36066.313300.345117.624017.013882.624324.274035.566867.187351.518213.058130.729263.677941.210888.82
融资偿还额(万元)10384.6617034.514578.812830.8813158.028375.995785.994585.132969.313483.664876.477917.816422.647352.139745.598262.628701.0411504.628308.248800.78
融券余量(万股)00000000000000000000
融券卖出量(万股)00000000000000000000
融券偿还量(万股)00000000000000000000
融券余额(万元)00000000000000000000
融资融券余额(万元)76329.7777266.9167411.5765258.9566386.2158819.6851399.3751119.0552403.8350255.5249722.1750716.0154309.5457450.8357935.7860329.8660379.4360949.7563190.763557.74
融资融券差额(万元)76329.7777266.9167411.5765258.9566386.2158819.6851399.3751119.0552403.8350255.5249722.1750716.0154309.5457450.8357935.7860329.8660379.4360949.7563190.763557.74
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