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利扬芯片(688135)
融资融券更新时间：2025-09-25
指标2025-09-252025-09-242025-09-232025-09-222025-09-192025-09-182025-09-172025-09-162025-09-152025-09-122025-09-112025-09-102025-09-092025-09-082025-09-052025-09-042025-09-032025-09-022025-09-012025-08-29
融资余额(万元)31088.1830565.9431535.528877.4228147.8827858.6222270.721109.6820544.6520058.9121516.1721862.9322272.9221826.2621958.420176.1922299.1920897.3915600.6716453.51
融资买入额(万元)10409.815391.6415508.7912065.7712091.7420268.5111034.494169.954901.327904.967054.562875.153886.435309.737022.027758.2112276.5415575.983995.682621.4
融资偿还额(万元)9887.5616361.212850.7111336.2311802.4914680.599873.463604.934415.589362.227401.323285.143439.765441.875239.89881.2210874.7410279.264848.522966.93
融券余量(万股)00000000000000000000
融券卖出量(万股)00000000000000000000
融券偿还量(万股)00000000000000000000
融券余额(万元)00000000000000000000
融资融券余额(万元)31088.1830565.9431535.528877.4228147.8827858.6222270.721109.6820544.6520058.9121516.1721862.9322272.9221826.2621958.420176.1922299.1920897.3915600.6716453.51
融资融券差额(万元)31088.1830565.9431535.528877.4228147.8827858.6222270.721109.6820544.6520058.9121516.1721862.9322272.9221826.2621958.420176.1922299.1920897.3915600.6716453.51
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